Capping Tools Tame Electromigration

By Mark LaPedus The shift towards the 28nm node and beyond has put the spotlight back on the interconnect in semiconductor manufacturing. In chip scaling, the big problem in the interconnect is resistance-capacitance (RC). Another, and sometimes forgotten, issue is electromigration. “Electromigration gets worse in device scaling,” said Daniel Edelstein, an IBM Fellow and manager of BE... » read more