Advanced Packaging Requires Better Yield


Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: IoT


Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

Joint R&D Has Its Ups And Downs


As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Manufacturing Bits: Sept. 6


DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

System Bits: Aug. 23


Monitor side-channel signals for IoT device security Thanks to a Defense Advanced Research Projects Agency (DARPA) grant, Georgia Tech researchers are working to develop a new technique for wirelessly monitoring IoT devices for malicious software – without affecting the operation of the ubiquitous, and low-power equipment. The team said the technique will rely on receiving and analyzing s... » read more

Manufacturing Bits: March 29


Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more

Power/Performance Bits: Feb. 9


Molybdenum disulfide memristors Researchers at Michigan Technological University constructed an ideal memristor based on molybdenum disulfide nanosheets. "Different from an electrical resistor that has a fixed resistance, a memristor possesses a voltage-dependent resistance," said Yun Hang Hu, professor of materials science and engineering at MTU, adding that a material's electric propert... » read more

Manufacturing Bits: Jan. 5


New materials for 3D printing HRL Laboratories has developed a new ceramic technology for 3D printing. The technology overcomes the limits of traditional ceramic processing, thereby enabling high-strength components. Ceramics are much more difficult to process than traditional 3D printing materials, such as polymers or metals, according to HRL, a corporate R&D laboratory owned by The Boeing... » read more

Manufacturing Bits: Dec. 23


World’s smallest inkjet image ETH Zurich and Scrona have set the official world’s record for the smallest inkjet-printed color image. The feat, which has been recognized by the Guinness World Records, is based on Scrona’s so-called NanoDrip printing technology and quantum dots. ETH and Scrona printed an image of clown fishes and sea anemones. The printed image measures 0.0092mm² in a... » read more

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