Advanced Packaging Is Suddenly Very Cool


The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

The Road To Autonomous Driving Is Paved With New Opportunities For Chip Companies


The migration from human-driven to self-driven vehicles in the next few years will provide the semiconductor industry with new opportunities. Vehicles on the road today have so far featured only a few digital enhancements and even less automation. Indeed, the most noticeable enhancements have been made in the advancement of the infotainment console within the dashboard – the ability to str... » read more

System Bits: Nov. 14


Tracking cyber attacks According to Georgia Tech, assessing the extent and impact of network or computer system attacks has been largely a time-consuming manual process, until now since a new software system being developed by cybersecurity researchers here will largely automate that process, allowing investigators to quickly and accurately pinpoint how intruders entered the network, what data... » read more

Chiplets Gaining Steam


Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

DARPA CHIPS Program Pushes For Chiplets


While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

Get Ready For In-Mold Electronics


Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

The Week In Review: IoT


Deals Deere & Co. has agreed to acquire Blue River Technology of Sunnyvale, Calif., for $305 million. The transaction is expected to close this month. Blue River develops computer vision and machine learning technology for use in precision agriculture. Monsanto Growth Ventures, Data Collective Venture Capital, Innovation Endeavors, Khosla Ventures, and Pontifax AgTech were among the investors... » read more

The Week In Review: Design


Tools Cadence unveiled an integrated memory design and verification tool, with environments for bitcell design, array and complier verification, and memory characterization. It utilizes existing simulation databases for multi-corner and Monte Carlo analysis, which the company says can lead to a 2X runtime improvement. Solido Design Automation uncorked PVTMC Verifier, which uses machine lear... » read more

A Chip For All Seasons


FPGAs are showing up in more designs and in more markets, and as they get included in more systems they are becoming much more complex. A decade ago, the key markets for [gettech id="31071" t_name="FPGAs"] were industrial, medical, automotive and aerospace. Those markets remain strong, but FPGAs also are playing a role in artificial intelligence, data centers, the [getkc id="76" kc_name="... » read more

What’s New At Hot Chips


By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

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