By Mark LaPedus
In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips.
Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more