Power/Performance Bits: Feb. 7


Infrared links for data centers Researchers at Penn State, Stony Brook University and Carnegie Mellon University developed a free space optical link for communication in data centers using infrared lasers and receivers mounted on top of data center racks. According to Mohsen Kavehrad, professor of electrical engineering at Penn State, "It uses a very inexpensive lens, we get a very narrow... » read more

Power/Performance Bits: Jan. 3


Paper-based bacteria battery Researchers at Binghamton University, State University of New York have created a bacteria-powered battery on a single sheet of paper that can power disposable electronics. The manufacturing technique reduces fabrication time and cost, and the design could revolutionize the use of bio-batteries as a power source in remote, dangerous and resource-limited areas. ... » read more

Manufacturing Bits: Nov. 23


Materials database The Department of Energy’s Lawrence Berkeley National Laboratory has published a study that quantifies the thermodynamic scale of metastability of some 29,902 materials. To quantify the materials, researchers used Berkeley Lab’s Materials Project, a large and open database of known and predicted materials. The open and Web-based database has calculated the properties ... » read more

Manufacturing Bits: Nov. 15


Tiny magnifying glass The University of Cambridge has devised what researchers claim is the world’s smallest magnifying glass. More specifically, researchers developed a tiny optical cavity, dubbed a pico-cavity. The pico-cavity consists of self-assembled, biphenyl-4-thiol molecules. These materials are sandwiched between gold nanostructures the size of a single atom. With the pico-cav... » read more

Manufacturing Bits: Oct. 18


Measuring gooey materials The National Institute of Standards and Technology (NIST) and Thermo Fisher Scientific have devised an instrument that correlates the flow properties of “soft gooey” materials, such as gels, molten polymers and biological fluids. The instrument, called a rheo-Raman microscope, combines three instruments into one system. First, the system incorporates a Raman sp... » read more

Manufacturing Bits: Sept. 13


Direct-write liquid litho The Department of Energy’s Oak Ridge National Laboratory has developed what could be called direct-write liquid lithography. In the lab, researchers have modified a scanning transmission electron microscope (STEM). Then, using the STEM as an e-beam tool, researchers have devised a technology that enables the direct write of tiny features in “microfabricated liq... » read more

Manufacturing Bits: Aug. 16


Safer drinking water Two-dimensional materials are gaining steam in the R&D labs. 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). These materials could one day enable future field-effect transistors (FETs). One TMD, molybdenum disulfide (MoS2), is also generating interest in other fields. Molybdenum disulfide consists of two elements--moly... » read more

Manufacturing Bits: Aug. 9


Faster FEBIDs Focused electron beam induced deposition (FEBID) is generating steam in the industry. Still in the R&D stage, FEBID makes use of an electron beam from a scanning electron microscope. Basically, it decomposes gaseous molecules, which, in turn, deposit materials and structures on a surface at the nanoscale. One of the big applications is a futuristic manufacturing technology... » read more

Manufacturing Bits: Feb. 23


EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

Manufacturing Bits: Feb. 9


3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

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