Putting “Design” Back Into Design For Test In PCB Products


Design for manufacturing (DFM) has become a proactive part of the design process, but the same cannot be said for DFT. Whereas “left-shifting” DFM has reduced manufacturing problems, increased yield, reduced scrap levels, and simplified engineering rework, testability-related improvements have stayed flat during that same time. Unfortunately, as assembly costs have come down, and test-relat... » read more

Looking At Test Differently


Wilhelm Radermacher, executive advisor at [getentity id="22816" e_name="Advantest"], sat down with Semiconductor Engineering to discuss how the impact of rapid market changes, advanced packaging approaches and increasing complexity on test strategies and equipment. What follows are excerpts of that conversation. SE: As we move into new markets where use models and stresses on devices are dif... » read more

A Simple Way To Improve Automotive In-System Test


The remarkable growth in automotive IC design has prompted a focus on ISO26262 functional safety compliance, which includes both high-quality manufacturing test and a minimum stuck-at test coverage of 90% for in-system test. Designers must also control IC test data volumes, test application times, and test costs. A new test point technology that improves in-system test coverage and reduces patt... » read more

Tessent MissionMode: New Inline DFT Technology


Written for automotive OEMs and suppliers, this whitepaper gives an overview of design-for-test (DFT) technology. Among the topics addressed: Why is DFT important in IC design generally and critical for creating automotive ICs in particular? And how does the new Tessent MissionMode technology, teamed with some of Mentor’s other DFT offerings, pave the way for the automotive industry to develo... » read more

Smarter DFT Infrastructure And Automation Emerge As Keys To Managing DFT Design Scaling


By Ron Press and Vidya Neerkundar The reality of DFT for large and complex SoCs has introduced new risk into design schedules. DFT teams end up in the critical path to tape out while waiting for portions of the design to be complete, and there are more DFT integration steps than ever before. The traditional approaches to DFT work on huge designs pose problems of repeatability and reliability... » read more

Changes Ahead For Test


Testing microprocessors is becoming more difficult and more time consuming as these devices are designed to take on more complex tasks, such as accelerating artificial intelligence computing, enabling automated driving, and supporting deep neural networks. This is not just limited to microprocessors, either. Graphics processing units are grabbing market share in supercomputing and other area... » read more

Effective Management Of System Designs


With the advent of the Internet-of-Things (IoT), system designs are slowly but surely becoming more complex. They now use heterogeneous architectures both on the System-on-Chip (SoC) and within a package. These systems typically have multiple different CPU cores, hardware accelerators, memories, network-on-chip (NoC) fabrics and numerous peripheral interfaces. Now, add to this the complexiti... » read more

Tech Talk: eFPGA Test


Volkan Oktem, director of product applications at Achronix, explains how to design a test approach for embedded FPGAs, including how to plan for sufficient coverage and how much it will cost. https://youtu.be/aGXd8QH-BfY   Related Stories Tech Talk: EFPGA Acceleration When and why to use embedded FPGAs. » read more

Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

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