Fab Tool M&A Slowdown?


The semiconductor industry is in the midst of a dizzying array of mergers and acquisitions. At the current pace, some 32% of all U.S. publicly traded semiconductor companies are projected to get acquired in 2015, according to FBR. But in reality, the M&A activity will slow and edge towards a 15% consolidation rate for the year, according to the firm. Still, the IC industry is bracing for... » read more

Analysis: Applied-TEL Scrap Merger


After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal. Now that the deal has been terminated, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as fierce comp... » read more

The Week In Review: Manufacturing


For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. Now, Altera will soon select a foundry partner for 10nm. “Altera will make a decision on which foundry partner it will choose for 10nm finFET at the end of 1Q15, noting it will decide between Intel and TSMC,” said John Vin... » read more

The Week In Review: Manufacturing


As semiconductor technology becomes more challenging, expect more mergers and acquisitions in the fab tool sector. In a research report issued this week, Weston Twigg, an analyst with Pacific Crest Securities, sees several possible M&A scenarios in the future. There is no evidence that any deal is pending right now. But according to Twigg, here are some possible M&As that could happen i... » read more

The Week In Review: Manufacturing


SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

DSA, Multi-beam Make Steady Progress


Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more