Etch Techniques for Next-Generation Storage-Class Memory


Chipmakers make abundant use of two very different functional classes of memory in their products. For operational use (main/primary memory) where speed is critical, DRAM and SRAM are employed, whereas for long-term storage, flash memory – in particular NAND – provides the high capacity at low cost needed. For both classes, efforts to improve speed, capacity, and power usage are ongoing. To... » read more

Defining Edge Memory Requirements


Defining edge computing memory requirements is a growing problem for chipmakers vying for a piece of this market, because it varies by platform, by application, and even by use case. Edge computing plays a role in artificial intelligence, automotive, IoT, data centers, as well as wearables, and each has significantly different memory requirements. So it's important to have memory requirement... » read more

Tech Talk: HBM vs. GDDR6


Frank Ferro, senior director of product management at Rambus, talks about memory bottlenecks and why both GDDR6 and high-bandwidth memory are gaining steam and for which markets. https://youtu.be/CPqdZZooS2g » read more

Architecture, Materials And Software


AI, machine learning and autonomous vehicles will require massive improvements in performance, at the same power consumption level (or better), over today's chips. But it's obvious that the usual approach of shrinking features to improve power/performance isn't going to be sufficient. Scaling will certainly help, particularly on the logic side. More transistors are needed to process a huge i... » read more

High-Performance Memory Challenges


Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

Do Superconducting Processors Really Need Cryogenic Memories?


Cryogenic, superconducting digital processors offer the promise of greatly reduced operating power for server-class computing systems. This is due to the exceptionally low energy per operation of Single Flux Quantum circuits built from Josephson junction devices operating at the temperature of 4 Kelvin. Unfortunately, no suitable same-temperature memory technology yet exists to complement these... » read more

How To Choose The Right Memory


When it comes to designing memory, there is no such thing as one size fits all. And given the long list of memory types and usage scenarios, system architects must be absolutely clear on the system requirements for their application. A first decision is whether or not to put the memory on the logic die as part of the SoC, or keep it as off-chip memory. "The tradeoff between latency and th... » read more

The PCB Engineer’s Guide To Successful DDR Bus Design


This paper tackles the critical signal integrity concerns encountered when designing, simulating, and analyzing DDR buses. The first section describes DDR bus design challenges that can be particularly problematic, even intimidating, to designers. Subsequent sections describe how simulation and analysis speed up the design of a functioning DDR system to reduce PCB spins and shorten the time to ... » read more

The Next 5 Years Of Chip Technology


Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational litho products at ASML; and Shay... » read more

Will China Succeed In Memory?


China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

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