Start Your HBM/2.5D Design Today


High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. In June 2015, AMD introduced its Fiji processor, the first HBM 2.5D design, which comp... » read more

Tech Talk: Cryogenic DRAM


Rambus Chief Scientist Craig Hampel talks with Semiconductor Engineering about quantum computing and the power/performance benefits of running DRAM at extremely low temperatures. https://youtu.be/3qu2mspJeM0 » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

The Week In Review: Design


Tools Mentor unveiled new formal-based technologies in the Questa Verification Solution. It offers formal-based RTL-to-RTL equivalence checking flows optimized for verification of manual low-power clock gating, bug fix and ECO validation, and ISO 26262 safety mechanism verification, which the company says which can reduce verification turnaround time by 10X. The app also offers expanded cloc... » read more

The Week In Review: Design


M&A Siemens closed the acquisition of Mentor Graphics, making Mentor now part of Siemens' product lifecycle management (PLM) software business. The $4.5 billion deal, announced last November, brings Siemens into the IC design tool and embedded software markets and expands Siemens' multi-physics and electronic simulation capabilities in the growing digital twin space, which ties together ... » read more

Optimal Memory Strategies: Where HBM2 Fits


How are you going to build your next big product? Whether it’s in the networking, wireless, mobile or computing market, you are now increasing the functionality of your product. It needs to be able to do many tasks – fast, at low power, and pack as much functionality into the tiniest area for cost effectiveness. What does this mean for the embedded memory content? It is growing rapidly. ... » read more

China: Fab Boom or Bust?


China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

Semiconductor CapEx To Increase 4.3% In 2017


Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

Get Ready For Nanotube RAM


The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

New Memories And Architectures Ahead


Memory dominates many SoCs, and it is rare to hear that a design contains too much memory. However, memories consume a significant percentage of system power, and while this may not be a critical problem for many systems, it is a bigger issue for Internet of Things ([getkc id="76" kc_name="IoT"]) edge devices where total energy consumption is very important. Memory demands are changing in al... » read more

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