Blog Review: Sept. 14

Are wide bandgap lll-V power devices feasible? Applied's Ben Lee considers the challenges, and potential rewards, of silicon carbide and gallium nitride. DVCon India chair Gaurav Jalan chats with keynote speaker Alok Jain about the challenges of verifying complex SoCs, the unique verification needs of the IoT, and what might lie beyond UVM. From power intent abstraction to automatic power... » read more

Blog Review: Sept. 7

In a video, Cadence's Kishore Kasamsetty contends that one-size-fits-all DDR PHY no longer works and looks into the unique requirements of different application segments. Synopsys' Eric Huang gives a brief overview of the five components required for USB certification. Mentor's Andrew Macleod presents a way Apple Cars could rake in revenue beyond the vehicle itself. When it comes to hi... » read more

The Week In Review: Design

Tools Aldec uncorked its TySOM embedded development kit, which includes Riviera-PRO mixed-HDL language simulation for VHDL 2008/Verilog 2005, a Xilinx Zynq-based development board and pre-validated Ubuntu Embedded Host reference designs and tutorials. Mentor Graphics introduced the first phase of its new Xpedition PCB design flow with technologies for design and verification of rigid and ... » read more

The Week In Review: Design/IoT

M&A Tessera boosted its 2.5D and 3D-IC capabilities with the acquisition of Ziptronix. The $39 million cash purchase adds a low-temperature wafer bonding technology platform, which has been licensed to Sony for volume production of CMOS image sensors. Numbers Semico Research forecasts that the SoC market will approach $200 billion by 2019. According to its analysis, average die are... » read more