Mask Maker Worries Grow

Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

Speeding Up Mask Production

Chip production is becoming more complex and expensive at each node. As a result, chipmakers require a growing number of new manufacturing technologies to enable the next wave of devices at advanced nodes. In the fab, for example, the most obvious need is extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. In addition, chipmakers also need a new class of atomic-level proces... » read more

Securing Chips During Manufacturing

David Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware. SE: How did you get into the anti-counterfeiting business? Lam: About three years ago we were working with some customers that were troubled by the counterfeiting problem. We became aware of that sense o... » read more

Executive Insight: Aki Fujimura

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to look at the key issues in lithography and photomasks, as well as the changes taking place in the IC industry. What follows are excerpts of that conversation. SE: The semiconductor market is changing on several fronts. On one front, there is a wave of consolidation in the industry. And then there is a slowdown in... » read more

Manufacturing Bits: June 21

Atomic sculpting Oak Ridge National Laboratory has combined a scanning transmission electron microscope (STEM) with new electronic controls. This tool enables the construction, or the atomic sculpting, of 3D-like feature sizes down to 1nm and 2nm. To achieve these dimensions, the STEM is controlled with a special set of programmable electronics. This, in turn, enables the STEM to tunnel in... » read more

Manufacturing Bits: April 26

Multi-beam inspection For some time, Singaporean startup Maglen has been developing a multi-beam e-beam inspection tool technology. Now, Maglen has reached two milestones. First, it has devised a full column test stand. The test stand includes a mechanical column and software. The second milestone is also significant. “We also dropped our beam and obtained our very first images,” sai... » read more

The Week In Review: Manufacturing

Chipmakers In a blog, GlobalFoundries discussed the global push towards 5G or fifth-generation wireless networks. Samsung Electronics Australia has announced the creation of brainBAND, a wearable technology designed to facilitate research into concussions in sports. In the prototype, a headband houses sensors at the back of the head that measure the force of an impact. This information wou... » read more

Manufacturing Bits: March 15

More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

Survey: Mask Complexity To Increase

The eBeam Initiative today released its annual members’ perceptions survey, a set of results that reveals some new and surprising data about EUV, multi-beam and photomask technology. As part of the results in the new survey, there is a growing level of optimism for the implementation of extreme ultraviolet (EUV) lithography in high-volume manufacturing, as compared to last year’s result... » read more

New Patterning Paradigm?

Chip scaling is becoming more difficult at each process node, but the industry continues to find new and innovative ways to solve the problems at every turn. And so chipmakers continue to march down the various process nodes. But the question is for how much longer? In fact, at 16nm/14nm and beyond, chipmakers are finding new and different challenges, which, in turn, could slow IC scaling or br... » read more

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