The Week In Review: Manufacturing


Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

Electronic Labeling Takes Off


One hit product for the Internet of Things (IoT) market is the electronic shelf label (ESL). The ESL is rapidly replacing the paper price labels on store shelves throughout Europe and Asia, as well as within retail giants such as Walmart in the United States. But why are retailers replacing nearly zero cost paper labels with an electronic widget that sells for on the order of $5 each (prici... » read more