Heat Problems Grow With FinFETs, 3D-ICs

From high-end consumer devices to rack-mounted arrays inside of data centers, thermal issues are becoming more serious—and getting much more attention. Driving this shift is the move from single chips to 3D ICs, whether they are interposer-based or stacked die. It’s a well-understood challenge: Die stacking can cause thermal issues because of the lack of a readily accessible thermal diss... » read more