Implementing ESD Protection In Today’s SoCs

As the semiconductor industry transitions to FinFETs, reliability challenges are increasing. ESD designers are challenged with new issues that would require significant rethinking and redesign of their existing ESD protection strategy. With significant complexity embedded in the silicon, failure analysis and silicon debug is challenging and time consuming even to the ESD experts. Technology ... » read more

Working With FinFETs

One of the key technology trends driving semi-conductor industry is the adoption of finFET processes. As opposed to a traditional planar transistor, the finFET has an elevated channel or “fin,” which the gate wraps around. Due to their structure, finFETs generate much lower leakage power and allow greater device density. Compared to planar transistors, finFET operate at a lower voltage and ... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

Making Cars Better

The automotive industry, with its double-digit growth, is a very attractive market for equipment manufacturers. This growth is explained not only by the increasing number of cars produced for the Asia market, but also by the shift of basic customer expectations for things such as more hybrid and electrical vehicles, more sophisticated infotainment requirements, and more high-end features. O... » read more

Manufacturing Bits: April 14

Monster waves of light The FOM Institute AMOLF has observed what researchers call monster waves of light. In this phenomenon, monster waves of light appear from nowhere and then disappear again. Researchers have shown that it is possible to influence the probability of this phenomenon. As a result, the technology could lead to faster telecommunication systems or more sensitive sensors, acco... » read more

Stacked Die, Phase Two

The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

The Interconnected Web Of Power

Tradeoffs between area and timing used to follow fairly simple rules. You could improve timing by adding area, and occasionally find an architectural solution that would decrease both at the same time. With physical synthesis the relationship became a little more complicated because an increase in area, say to make a drive larger or add another buffer, might upset the layout. That, in turn, cou... » read more

Why Is My Device Better Than Yours?

Differentiation is becoming a big problem in the semiconductor industry with far-reaching implications that extend well beyond just chips. The debate over the future of [getkc id="74" comment="Moore's Law"] is well known, but it's just one element in a growing list that will make it much harder for chip companies, IP vendors and even software developers to stand out from the pack. And withou... » read more

Supporting LP In New Process Nodes

Manufacturing process nodes and EDA tools are advancing all the time, but not always utilized at the same pace. And from a tools perspective, there are challenges to supporting low power in new process nodes while maintaining and improving the existing process nodes. One way design teams address this is by leveraging the most advanced software on the less-than-bleeding edge designs. To th... » read more

System-Aware SoC Power, Noise And Reliability Signoff

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

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