Timing Closure Issues Resurface


Timing closure has resurfaced as a major challenge at 10nm and 7nm due to more features and power modes, increased process variation and other manufacturing-related issues. While timing-related problems are roughly correlated to rising complexity in semiconductors, they tend to generate problems in waves—about once per decade. In SoCs, timing closure problems have spawned entire methodolog... » read more

New Wave Of Consolidation


Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Healthcare IoT: Promise And Peril


By Gale Morrison & Ed Sperling As more connectivity and communication capability is built into everyday healthcare and medical devices, engineers are tasked with ensuring these devices are both completely secure and ultra-reliable. Reliability generally is measured in mean time between failure (MTBF), but when it comes to safety-critical markets, that equation takes on a whole new... » read more

Moore’s Law Debate Continues


Does shrinking devices still make sense from a cost and performance perspective? The answer isn’t so simple anymore. Still, the discussion as to whether semiconductors are still on track with [getkc id="74" comment="Moore's Law"] occurs on a frequent enough basis to continue analyzing at least some of the dynamics at play. There is much speculation about what happens after 7nm, as well as ... » read more

Silicon Photonics Comes Into Focus


Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

IoT – And A Tear In The Fabric Of The Connected World


Billions of connected things. Massive silicon consumption. Exponentially rising data volumes. Global compute farm build-out to make sense out of all of it. Lots of dollar signs. Everyone is talking about IoT with an optimistic view toward the future. There is a dark side to all this. Many, including yours truly have written about it. If you’re familiar with the Terminator series, you can call... » read more

Find The Best IP For You


It can be quite challenging and time consuming to find the right semiconductor IP for your project. You’ve got to find IP that does not consume too much power, meets your performance target, has the lowest leakage when your product goes on standby, and last but not least, IP that occupies the least amount of expensive real estate on your chip. How can you accomplish such a task without having... » read more

2.5D Surprises And Alternatives


Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at [getentity id="22017" e_name="Mentor Graphics"]; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon's"] senior director of IP marketing. What follows are excerpts of that conversation. ... » read more

What Can Go Wrong In Automotive


Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

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