New Drivers For I/O


Interface standards are on a tear, and new markets are pushing the standards in several directions at the same time. The result could be a lot more innovation and some updates in areas that looked to be well established. Traditionally, this has been a sleepy and predictable part of the industry with standards bodies producing updates to their interfaces at a reasonable rate. Getting data int... » read more

Chiplets Gaining Steam


Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

Tech Talk: Pseudo SRAM


eSilicon's Kar Yee Tang explains how to improve performance at 10/7nm without affecting power and area. https://youtu.be/4LI1pBLxxS4 » read more

The Week In Review: Design


M&A Synopsys acquired Sidense, a provider of antifuse one-time programmable (OTP) non-volatile memory (NVM) for standard-logic CMOS processes. Sidense was founded in 2004 in Canada. Terms of the deal were not disclosed. ArterisIP acquired the software and intellectual property rights of iNoCs, a provider of network-on-chip IP and design tools. Founded in 2007, the Swiss company was spun... » read more

Toward System-Level Test


The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Starting Point Is Changing For Designs


The starting point for semiconductor designs is shifting. What used to be a fairly straightforward exercise of choosing a processor based on power or performance, followed by how much on-chip versus off-chip memory is required, has become much more complicated. This is partly due to an emphasis on application-specific hardware and software solutions for markets that either never existed befo... » read more

Talking The Talk On Training


In my prior post, I discussed the value of good design flow training. A properly executed program can turn average engineers into above average problem solvers with the right tools and techniques. We got to thinking about this opportunity quite seriously at eSilicon. Is there a way to develop a focused, intense training program to create a new “army” of elite designers? In short, we thin... » read more

Tech Talk: TCAM


Dennis Dudeck, IP solutions FAE at eSilicon, talks about how to save power and area with ternary content addressable memory. https://youtu.be/y1FhdoNdzOw » read more

Managing Peak Power


Peak power is becoming a serious design constraint across chips and entire electronic systems as more functionality is added into end devices and the compute and switching infrastructure needed to support them. The issues are a direct result of growing complexity in designs, fixed or shrinking power budgets, and the need to process more data more quickly. In mobile devices, the addition of m... » read more

The Week In Review: Design


Tools Cadence unveiled a new equivalence checking tool which features a massively parallel architecture capable of scaling to 100s of CPUs and adaptive proof technology that analyzes each partition and determines the optimal formal algorithm. According to the company, the Conformal Smart Logic Equivalence Checker provides an average of 4X runtime improvement with the same resources over the pr... » read more

← Older posts