More Lithography/Mask Challenges


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

What Happened To Nanoimprint Litho?


Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Smaller, Faster, Cheaper—But Different


The old mantra of "smaller, faster, cheaper" has migrated from the chip level to the electronic system level, raising some interesting questions about where the real value is being generated. Smaller as it pertains to gate size, line widths and spaces, will continue in an almost straight line for at least the next decade. The ability to print three-dimensional features on a nanoscale using E... » read more

EUV’s New Problem Areas


Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

AI: The Next Big Thing


The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

DSA Re-Enters Litho Picture


By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

The Week In Review: Manufacturing


Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

Executive Insight: Wally Rhines


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to discuss a wide range of industry and technology changes and how that will play out over the next few years. What follows are excerpts of that conversation. SE: What will happen in the end markets? Rhines: The end markets are perhaps more exciting from a... » read more

Tech Talk: 5/3nm Parasitics


Ralph Iverson, principal R&D engineer at Synopsys, talks about parasitic extraction at 5/3nm and what to expect with new materials and gate structures such as gate-all-around FETs and vertical nanowire FETs. https://youtu.be/24C6byQBkuI » read more

What EUV Brings To The Table


After many years of hearing that EUV is almost ready for prime time, the tide is finally coming in. A decade of slow but steady progress has resulted in exposure tools that can expose on the order of 1,000 wafers a day on a regular basis. This may be shy of the requirements for high volume manufacturing (HVM), but it is certainly more than enough to support solid development programs and pilot ... » read more

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