The Week In Review: Manufacturing


Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

The Week In Review: Manufacturing


In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

Manufacturing Bits: Feb. 9


3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

Rise Of The Old Fab


Growth in the [getkc id="260" comment="Internet of Everything"], along with the beginning of a shift toward systems in package, are creating buzz in a rather unlikely place—established and well-worn process nodes where equipment is scarce, semi-functional, and difficult to maintain. In the past, moving to the next node was a sign of progress, leaving behind the trailing edge of designs to ... » read more

Fan-Out Packaging Gains Steam


Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

China’s Fab Tool Biz Heats Up


For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

Manufacturing Bits: Oct. 20


Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

Advanced IC Packaging Biz Heats Up


After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

The Week In Review: Manufacturing


Semicon West is always a busy week. Typically, there are a plethora of events going on during the week. It’s also a good week to get a pulse on the industry. The good news: Innovation is alive and well. Bad news: Intel cut its CapEx. And tool makers are in the midst of a lull right now, with a cloudy outlook projected for 2016. Some even see a dreaded downturn next year. Pacific Crest Secu... » read more

When Will 2.5D Cut Costs?


There is a constant drive to reduce costs within the semiconductor industry and, up until now, [getkc id="74" comment="Moore's Law"] provided an easy path to enable this. By adopting each smaller node, transistors were cheaper, but that is no longer the case, as explained in a recent article. The industry will need to find new technologies to make this happen and some people are looking towards... » read more

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