The Week In Review: Manufacturing


Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

The Week In Review: Manufacturing


Intel has submitted a business plan to upgrade its fab in Israel, according to reports. Crocus Nano Electronics (CNE), the joint venture founded in 2011 by Crocus Technology and Russia’s RUSNANO, has raised $60 million from its investors. The venture is Russia’s first 300mm fab. This first production line was completed one year after construction began. Currently, 200mm and 300mm CMOS wa... » read more

Week In Review: Manufacturing, Design, Test


A new study from Crucial.com reveals that on some days, 64% of U.S. parents spend more time with their computers than with family or close friends. TSMC posted mixed results in the fourth quarter of 2013. It also announced flat CapEx targets for 2014. TSMC also addressed Intel’s recent comments about TSMC’s finFET plans. Morris Chang, chairman of TSMC, said Intel’s comments are mislead... » read more

The Week In Review: July 15


By Mark LaPedus There are more problems surfacing with extreme ultraviolet (EUV) lithography. Yes, the light source remains a problem, but the resists appear to be in decent shape. “The next challenge is the mask blank,” said Stefan Wurm, director of Sematech’s lithography program. The new problem involves ion beam deposition, which apparently is causing defects and overfill on EUV masks... » read more