Shortages Hit Packaging Biz


Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

28nm Chip-Package Interactions In Large eWLB FO-WLP


To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabl... » read more

Wirebond Technology Rolls On


Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

MEMS: Improving Cost And Yield


MEMS devices inspire awe on the design side. On the test and manufacturing side, they evoke a different kind of reaction. These are, after all, the intersection of mechanical and electrical engineering—a joining of two miniature worlds that are the basis of some of the most complex technology on the planet. But getting these devices to yield sufficiently, understanding what does or does no... » read more