tag: fan-out wafer-level packaging

Photonic Debond: Scalability And Advancements
By Brewer Science - 17 May, 2023 - Comments: 0

Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

The March Toward Chiplets
By Ed Sperling and Karen Heyman - 15 Dec, 2022 - Comments: 0

The days of monolithic chips developed at the most advanced process nodes are rapidly dwindling. Nearly everyone working at the leading edge of design is looking toward some type of advanced packaging using discrete heterogeneous components. The challenge now is how to shift the whole chip industry into this disaggregated model. It's going to take time, effort, as well as a substantial reali... » read more

Mastering FOWLP And 2.5D Design Is Easier Than You Think
By Bill Acito - 22 Nov, 2022 - Comments: 0

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by providing a platform for heterogeneous design assembly. Where designs implemented in an SoC can become too large to yield satisfactorily and too difficult to implement on one process node, pa... » read more

Fan-Out Packaging Gets Competitive
By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)
By Brewer Science - 18 May, 2022 - Comments: 0

A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this article. Four laser release materials were identified based on their absorption coefficient at 355 nm. In addition, all four of these materials possess thermal stability above 350 °C and pull-off adhesion on a Ti/Cu l... » read more

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

T. Fukushima, "Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE," 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: "More recently, "chiplets" are expected for further scaling the performance of LSI systems. However, system integration with the chiplets is not a new methodology. The basic concept dates back well over ... » read more

What Does It Take To Build A Successful Multi-Chip Module Factory?
By Mike McIntyre - 06 Jul, 2021 - Comments: 0

When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an announcement about “Company XYZ” moving their products into the fan-out wafer-level packaging (FOWLP) or fan-out panel-level packaging (FOPLP) space. But these moves come with challenges that didn’t ex... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS
By Amkor - 17 Feb, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

New RDL-First PoP Fan-Out Wafer-Level Package Process With Chip-to-Wafer Bonding Technology
By Amkor - 16 Dec, 2020 - Comments: 0

Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has many advantages for mobile applications such as low power consumption, short signal path, small form factor, and heterogeneous integration for multifunctions. In addition, it can be applied in various package platforms, including PoP, System-in-Package (SiP), and Chip Scale Package (CSP). These advantages come from advanced inte... » read more

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