Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review

By The SE Staff - 09 Feb, 2024 - Comments: 0

By Jesse Allen, Linda Christensen, and Liz Allan. The Biden administration plans to invest more than $5B for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Jun, 2022 - Comments: 0

Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 May, 2022 - Comments: 0

Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Week In Review: Design, Low Power

By Jesse Allen - 01 Apr, 2022 - Comments: 0

Tools Synopsys introduced a new model for using its EDA tools on the cloud. Synopsys Cloud provides pay-as-you-go access to the company's cloud-optimized design and verification products, with pre-optimized infrastructure on Microsoft Azure to address higher levels of interdependencies in chip development. "As more design flows incorporate AI, requiring even more resources, the virtually unlim... » read more

Week In Review: Design, Low Power

By Jesse Allen - 02 Jul, 2021 - Comments: 0

Tools Imperas and Valtrix inked a multi-year distribution and support agreement that makes Imperas simulation technology and RISC-V reference models available pre-integrated within Valtrix STING for RISC-V processor verification. The combined solution covers the full RISC-V specification for user, privilege, and debug modes, including all ratified standard extensions, and the near ratified (st... » read more

Week In Review: Design, Low Power

By Jesse Allen - 22 Jan, 2021 - Comments: 0

Cadence will acquire NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. “Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, board... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 24 Apr, 2020 - Comments: 0

Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Week In Review: Design, Low Power

By Jesse Allen - 24 Apr, 2020 - Comments: 0

Tools & IP Codasip unveiled its Codasip SweRV Core EH1 Support Package, which provides support for Western Digital's open source RISC-V-based core. The support package provides a comprehensive set of tools and components needed to design, implement, test, and write software for a SweRV Core-based SoC with support for leading EDA open and commercial flows. A free basic version is available ... » read more

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tag: Faraday Technology

Chip Industry Week In Review

Chip Industry Week In Review

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

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