Manufacturing Bits: Sept. 12


Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

The Week In Review: IoT


Q&A Francine Berman, a computer science professor at Rensselaer Polytechnic Institute, talks about ethical issues in the Internet of Things in this interview. She says, “First of all, we’re just at the tip of the iceberg in what is arguably going to be a brave new world. And it’s highly heterogeneous: We’ll be seeing a lot more autonomous systems, we’ll be seeing enhanced humans and ... » read more

When Cryptographers Disagree


Six of the world's leading cryptography experts sat down this week to explore the most pressing issues in security. They took up topics ranging from whether Apple should facilitate the FBI's access to a known terrorist's iPhone, to what will become the next important cryptography algorithm. Among them: Ronald Rivest, an Institute Professor at MIT; Adi Shamir, co-inventor of the RSA algorithm... » read more

Get Ready For More Biometrics


Security involving scans of fingerprints, palms, faces, or some other variant has been common in movies for years, and many phones and computers now offer fingerprint scans instead of a password login. But as security risks rise with the rollout of the [getkc id="76" comment="Internet of Things"]/Internet of Everything, that technology will need to become much more pervasive and sophisticated. ... » read more