Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

The Week In Review: Sept. 30


In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced having achieved a new world record for the conversion of sunlight into e... » read more