Manufacturing Bits: June 28

Redefining the kilogram The National Institute of Standards and Technology (NIST) has developed a new scale that could one day enable a new and improved definition of the kilogram. The scale is called the NIST-4 watt balance. It has conducted its first measurement of a physical quantity called Planck’s constant to within 34 parts per billion. The scale is not intended to alter the va... » read more

How To Build Systems In Package

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

SEMICON West Preview

By Paula Doe The fast growing demand for bandwidth is driving telecomm and data center user interest in moving high speed optical connections closer and closer to the chips, as recent advances in packaging technology, from microbumping to bonding to wafer-level redistribution now help make it possible. Chip-to-chip and chip-to-board optical connections increasingly look like a viable soluti... » read more

Challenges In 3D Resists

3D integration straddles the line between CMOS fabs and packaging and assembly houses. Depending on the structure being fabricated, the most appropriate process might be more “CMOS-like” or more “package-like.” For example, in CMOS fabs lithography means spin-on photoresist, exposed by a high precision stepper. Inherent in this approach is an assumption that the wafer surface is flat... » read more