Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Week In Review: Auto, Security, Pervasive Computing


AI predictions and announcements filled the news this week, including a statement from the Center for AI Safety that was signed by some top AI execs — including Sam Altman, CEO of OpenAI — warning that uncontrolled AI could end up smarter than us and lead to our extinction. Foxconn estimates its artificial intelligence server revenue will double this year with the popularity of generative A... » read more

Week In Review: Manufacturing, Test


Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The U.S. Federal Trade Commission (FTC) sued Nvidia to block the company’s $40 billion acquisition of Arm. The FTC said in a press statement that “the proposed vertical deal would give one of the largest chip companies control over the computing technology and designs that rival firms rely on to develop their own competing chips. … the combined firm would have the means and in... » read more

Week in Review – IoT, Security, Autos


Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Week in Review: IoT, Security, Autos


Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week in Review: IoT, Security, Auto


Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries and the Chengdu municipality have signed an amendment and changed the strategy of their joint fab investment in Chengdu, China. Originally, GlobalFoundries was supposed to install 180nm/130nm processes in the China-based 300mm fab. The partners have decided to bypass that technology. Intead, the fab will start with GlobalFoundries’ 22nm FD-SOI process. “Ch... » read more

The Week in Review: IoT


Cybersecurity The United Kingdom government issued a policy report, Secure by Design, calling on Internet of Things device manufacturers to eliminate default passwords, to provide greater transparency in vulnerability disclosure, and to secure credential storage. The report urges shifting cybersecurity responsibility to IoT device vendors, rather than end-users, and protecting the privacy righ... » read more

ASE-SPIL Merger Wins Clearance


Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have finally received all anti-trust approvals for the proposed and long-awaited merger between the two IC packaging houses. The anti-trust approvals are a big step that clears the way for the creation of a combined ASE-SPIL entity. The ASE-SPIL entity, in turn, will create a powerhouse in the outsourced ... » read more

← Older posts