RF GaN Gains Steam

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

How Will 5G Work?

Sumit Tomar, general manager of the Wireless Infrastructure Products Group at RF chip giant Qorvo, sat down with Semiconductor Engineering to discuss the development of next-generation 5G wireless networks and other topics. In 2014, RF Micro Devices and TriQuint merged to form Qorvo. What follows are excerpts of that conversation. SE: 5G, the follow-on to the current wireless standard known ... » read more

Anything As A Service

Everything as a service promises to simplify our lives, from cutting edge business to consumer applications. It is too early to tell, but the concept of everything moving to the cloud poses some interesting issues, from bandwidth to security. Who would have guessed that in 2015, launching a business would require virtually no physical assets? You simply turn on your computer and everything y... » read more

Inside The 5G Smartphone

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

The Week In Review: Sept. 6

By Ed Sperling ARM acquired Cadence’s high-resolution display processor cores, which it helped to co-develop. Coupled with ARM’s own graphics, the move sets up ARM to sell complete subsystems. Cadence also won a deal with SMIC, which is using Cadence’s low-power flow and signoff technology for its 40nm process. Mentor Graphics won a deal with Advanced Wireless Semiconductor Co., whic... » read more

New Foundry Gold Rush: RF SOI

By Mark LaPedus About every five years or so, a new and hot market emerges in the specialty foundry business that resembles a frenetic gold rush. The last big gold rush occurred around 2008, when more than a dozen foundries jumped into the bipolar-CMOS-DMOS (BCD) market to capitalize on the booming power-management sector. Now, the next gold rush is centering on an emerging technology—th... » read more

CMOS And SOI Invade RF Front End

By Mark LaPedus The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but arguably the most critical part in a handset—the radio-frequency (RF) front-end. Typically, the RF front-end often comes in a module and includes various key components, such ... » read more

Over 50% Of Smart Phones And Tablets Leverage SOI

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In a recent press release, the SOI wafer leader Soitec said that chips built on its SOI wafers were found in over half of the smartphones and tablets in the market worldwide. 50%? That’s a lot! How do they figure that? The answer: RF. [caption id="attachment_809" align="alignleft" width="549" caption="As seen here... » read more

Smartphones Dial Up New RF Processes

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more