ALD Market Heats Up

Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup the landscape by rolling out a new, high-throughput ALD tool. Generally, [getkc id="250" kc_name="ALD"] is a process that deposits materials layer-by-layer at the atomic level, enabling thin and ... » read more

One-On-One: Mark Bohr

Semiconductor Engineering sat down to discuss process technology, transistor trends, chip-packaging and other topics with Mark Bohr, a senior fellow and director of process architecture and integration at Intel. SE: Intel recently introduced chips based on its new 14nm process. Can you briefly describe the 14nm process? Bohr: It’s our second-generation, tri-gate technology. So it has al... » read more

The Search For New Materials

It makes sense that the first chips were built out of silicon. It’s hard to think of a more abundant material than sand, or one that’s so easily accessible in so many places. It’s like building the first homes out of earthen bricks. There was never a shortage of materials. Even aluminum and copper for the wires and interconnects in these chips are readily available, despite the rising ... » read more