Defining Edge Memory Requirements


Defining edge computing memory requirements is a growing problem for chipmakers vying for a piece of this market, because it varies by platform, by application, and even by use case. Edge computing plays a role in artificial intelligence, automotive, IoT, data centers, as well as wearables, and each has significantly different memory requirements. So it's important to have memory requirement... » read more

Measuring And Analyzing SoC Performance With Verdi Performance Analyzer


SoC performance is a key competitive advantage in the marketplace. The choice and configuration of SoC components—protocol IP and interconnects, is geared towards maximizing overall SoC performance. A case in point is the use of HBM (High Bandwidth Memory) technology and controllers. Currently in its third generation, HBM boasts high-performance while using less power in a substantially small... » read more

Tech Talk: HBM vs. GDDR6


Frank Ferro, senior director of product management at Rambus, talks about memory bottlenecks and why both GDDR6 and high-bandwidth memory are gaining steam and for which markets. https://youtu.be/CPqdZZooS2g » read more

Challenges At The Edge


By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

Architecture, Materials And Software


AI, machine learning and autonomous vehicles will require massive improvements in performance, at the same power consumption level (or better), over today's chips. But it's obvious that the usual approach of shrinking features to improve power/performance isn't going to be sufficient. Scaling will certainly help, particularly on the logic side. More transistors are needed to process a huge i... » read more

How AI Impacts Memory Systems


Throughout the 1980’s and early 1990’s computer systems were bottlenecked by relatively slow CPU performance, thereby limiting what applications could do. Driven by Moore’s Law, transistor counts increased significantly over the years, improving system performance and enabling exciting new computing possibilities. Although computing capabilities have advanced significantly in recen... » read more

Toward High-End Fan-Outs


Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

Deconstructing Deep Learning


I discuss AI and deep learning a lot these days. The discussion usually comes back to “what is a deep learning chip?” These devices are basically hardware implementations of neural networks. While neural nets have been around for a while, what’s new is the performance advanced semiconductor technology brings to the party. Applications that function in real time are now possible. But wh... » read more

Deep Learning Spreads


Deep learning is gaining traction across a broad swath of applications, providing more nuanced and complex behavior than machine learning offers today. Those attributes are particularly important for safety-critical devices, such as assisted or autonomous vehicles, as well as for natural language processing where a machine can recognize the intent of words based upon the context of a convers... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design


This paper explores how advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company we profile is eSilicon, which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company ha... » read more

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