DAC Day Two: Down To Business


DAC day two started with a breakfast presentation put on by Synopsys which included guests from ARM, TSMC and HiSilicon. It was titled Collaborating to Enable Design with the latest processors and finFET processes. Collaboration is a word that we hear increasingly when talking about the advanced nodes and today we are truly at the point where one company cannot do it all. Ron Moore, VP of ma... » read more

The Week In Review: Design


Tools Mentor Graphics uncorked the latest version of its Catapult high-level synthesis platform, adding a formal-based C Property Checker tool to automatically identify and formally prove hard-to-find issues like uninitialized memory, divide by 0, and array bounds errors in the users' HLS C++/SystemC model. IP ARM unveiled the Cortex-A73 and Mali-G71 processors. According to ARM, the g... » read more

What Will China Do Next?


China's attempts to buy up U.S. chip companies is undergoing more gyrations, this time spurred by the exchange rate set by the People's Bank of China and the U.S. Federal Reserve's expected interest rate hikes. The central bank dropped the exchange rate of the yuan versus the dollar to its lowest rate since 2011, according to Bloomberg. The current rate is now 6.55 yuan per dollar, compared ... » read more

The Week In Review: Manufacturing


Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

The Week In Review: Manufacturing


SUNY Polytechnic Institute (SUNY Poly) and GlobalFoundries announced the establishment of a new Advanced Patterning and Productivity Center (APPC). The $500 million, 5-year program will accelerate the introduction of extreme ultraviolet (EUV) lithography technologies into manufacturing. The center is located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y. -------... » read more

The Week In Review: Manufacturing


Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

The Week In Review: Design/IoT


Tools Synopsys unveiled its comprehensive standard cell library characterization and QA solution, SiliconSmart ADV, highlighting a simple multi-core licensing scheme for easy adaptation to constantly changing characterization workload requirements. Cadence updated its Sigrity portfolio focusing on multi-gigabit interfaces, including automated support for IBIS-AMI model creation, channel m... » read more

Advanced Packaging Is Real. Now What?


For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip


Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

More Choices, Less Certainty


The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

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