The Week In Review: Manufacturing


Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

The Week In Review: IoT


Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

The Week In Review: IoT


Deals VMware this week announced Internet of Things strategic alliances with Bayshore Networks, Dell, Deloitte Digital, Intwine Connect, PTC, and V5 Systems. IDC estimates IoT spending will reach almost $1.3 trillion by 2019. "IoT is said to be the largest addressable market since the advent of the Internet, and the true potential of IoT has yet to be realized in the enterprise. As a company t... » read more

ASML To Buy Hermes


Looking to expand into new markets, ASML Holding has entered into an agreement to acquire e-beam wafer inspection specialist Hermes Microvision (HMI) in a cash transaction valued at 2.75 billion euros (US$3.08 billion). With the proposed acquisition of Taiwan’s HMI, ASML will enter two new markets—-wafer inspection as well as mask inspection for extreme ultraviolet (EUV) lithography. In ... » read more

The Week In Review: IoT


Taiwan’s annual Computex trade show, celebrating its 35th anniversary this year, opened this week, and the Internet of Things is among the focus areas of the exhibition. Tsai Ing-wen, the new president of Taiwan, said at the opening ceremony, “The IoT era is coming strong. Taiwan must focus on the integration of hardware and software along with low-volume, high-variety manufacturing capabil... » read more

The Week In Review: Design


Tools Mentor Graphics uncorked the latest version of its Catapult high-level synthesis platform, adding a formal-based C Property Checker tool to automatically identify and formally prove hard-to-find issues like uninitialized memory, divide by 0, and array bounds errors in the users' HLS C++/SystemC model. IP ARM unveiled the Cortex-A73 and Mali-G71 processors. According to ARM, the g... » read more

The Numbers Game


Industry executives making presentations on the Internet of Things often cite the famous estimate by Cisco Systems – 25 billion connected devices in 2015 will double to 50 billion connected devices in 2020. Also, the worldwide IoT market will grow 21% a year to $7 trillion by the end of this decade, according to IDC. Billions and trillions are at stake. Many chip companies, especially I... » read more

What’s Next In Mobile Displays


The next wave of smartphones and wearables is invading the market. These systems will feature a new class of high-resolution displays, and in the near future displays will become foldable and rollable, although there are still some challenges with this technology. To be sure, mobile display technology is advancing on several fronts. On one front, for example, Apple and other systems vendor... » read more

The Week In Review: Manufacturing


Lam Research’s proposed move to acquire KLA-Tencor is still generating a buzz in the industry. One executive from Lam has explained the reason for the deal. Meanwhile, analysts are also weighing in. “We believe the deal itself is a positive one for Lam as it supplements its leading etch position with the market share leader in process control with significant accretion and earnings leverage... » read more

Dealing With Atoms


Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that can process tiny structures and films, even at the atomic level. The problem? There are gaps in terms of techniques that can process chips at the atomic level. Looking to help fill part of the ... » read more

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