Gaps Remain For EUV Masks

Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come together before EUV is inserted into mass production at that node. First, the EUV source must generate more power. Second, tool uptime must improve. Third, the industry needs better EUV resists. A... » read more

Survey: Mask Complexity To Increase

The eBeam Initiative today released its annual members’ perceptions survey, a set of results that reveals some new and surprising data about EUV, multi-beam and photomask technology. As part of the results in the new survey, there is a growing level of optimism for the implementation of extreme ultraviolet (EUV) lithography in high-volume manufacturing, as compared to last year’s result... » read more

New Business Models Emerge

By Ed Sperling Globalization, complexity and the rising cost of chip development are changing business models across the semiconductor design world in some expected as well as some unusual ways. On a global basis, each new process node propels a new wave of disaggregation and disruption as the costs of design continue to skyrocket. What used to be under one roof is now shared by many. This ... » read more