Changes In China


By Jesse Zhang, SEMI China Industry leaders gathered in Beijing at BIMS 2016 — the Beijing International Microelectronics Symposium — to discuss growth opportunities for the semiconductor industry and the mobile communications market. The 17th session of BIMS was co-sponsored by SEMI and the Chinese-American Semiconductor Professionals Association (CASPA). For 17 years, BIMS has provi... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Teaching Computers To See


Vision processing is emerging as a foundation technology for a number of high-growth applications, spurring a wave of intensive research to reduce power, improve performance, and push embedded vision into the mainstream to leverage economies of scale. What began as a relatively modest development effort has turned into an all-out race for a piece of this market, and for good reason. Mark... » read more

Neural Net Computing Explodes


Neural networking with advanced parallel processing is beginning to take root in a number of markets ranging from predicting earthquakes and hurricanes to parsing MRI image datasets in order to identify and classify tumors. As this approach gets implemented in more places, it is being customized and parsed in ways that many experts never envisioned. And it is driving new research into how el... » read more

The Week In Review: Manufacturing


Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Building Chips That Can Learn


The idea that devices can learn optimal behavior rather than relying on more generalized hardware and software is driving a resurgence in artificial intelligence, machine leaning, and cognitive computing. But architecting, building and testing these kinds of systems will require broad changes that ultimately could impact the entire semiconductor ecosystem. Many of these changes are wel... » read more

The Week in Review: IoT


Deals The big news of the week, of course, is SoftBank Group’s proposed acquisition of ARM Holdings for a breathtaking $32.2 billion in cash. In announcing the deal, the companies made it abundantly clear that the proposed acquisition is chiefly about Internet of Things technology. “When I think about the investment and the commitment that’s going to be required to develop the future te... » read more

The Road To 5nm


There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is big-company consolidation. There are simply fewer customers left who can afford to build chips at the most advanced nodes. Intel bought Altera. Avago bought Broadcom. NXP bought Freescale. GlobalFoundrie... » read more

How Do We Get To Full Throttle In Mobile?


By Govind Wathan and Brian Fuller With each new generation of mobile device, we look forward to running the latest apps—especially games. (It's amazing how immersive mobile games have become in just a few years). We’re consumers but we’re also engineers, and here we’re faced with a huge challenge. It’s not just the games that get more powerful. A whole new generation of virtual ... » read more

How To Build Systems In Package


The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

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