tag: IDMs

Fabless IDMs Redefine The Leading Edge
By Marie C. Baca - 27 Oct, 2022 - Comments: 0

Large systems companies are looking more like integrated device manufacturers, designing their own advanced chips, packages, and systems for internal use. But because these are not pure-play chip companies, they are disrupting a 10-year cadence of customization and standardization that has defined the chip industry from its inception, and extending the period of innovation without the associate... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Emerging Apps And Challenges For Packaging
By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Data Confusion At The Edge
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Disparities in pre-processing of data at the edge, coupled with a total lack of standardization, are raising questions about how that data will be prioritized and managed in AI and machine learning systems. Initially, the idea was that 5G would connect edge data to the cloud, where massive server farms would infer patterns from that data and send it back to the edge devices. But there is far... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

What’s Next In R&D?
By Mark LaPedus - 21 Jun, 2018 - Comments: 1

Luc Van den hove, president and chief executive of Imec, sat down with Semiconductor Engineering to discuss R&D challenges and what’s next in the arena. The Belgium R&D organization is working on AI, DNA storage, EUV, semiconductors and other technologies. What follows are excerpts of that conversation. SE: Moore’s Law is slowing down. And it is becoming more expensive to move fr... » read more

Upcoming Hurdles For The Semiconductor Industry
By Ann Mutschler - 01 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys-Apache; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael... » read more

Experts At The Table: MEMS Challenges
By Mark LaPedus - 30 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. What follows are excerpts... » read more

Experts At The Table: Changes In The Ecosystem
By Ed Sperling - 15 Jul, 2013 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael Buehler-Garcia, director of design solutions marketing at Mentor Graphics; Seow Yin Lim, group director for marketing at Cadence; Kevin Kranen, director of strategic alliances at Synopsys, and Tom Quan, director at TSMC. What follows are excerpts of that conversation. SMD: Does the increasing collaboration in the ecos... » read more

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