Power Management Vs. State Machines


In the last several years, contemporary SoCs (systems-on-a-chip) have become very complex silicon solutions. They now consist of hundreds of millions of gates, 100 or more discrete Semiconductor Intellectual Property (SIP) blocks, high-speed data channels, megabytes of volatile and non-volatile embedded memory, increasing amounts of analog/mixed signal functionality, multiple CPU cores and mult... » read more

5 Takeaways from IEDM


As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

Manufacturing Bits: Dec. 13


Phonon lasers A European consortium recently kicked off a new project that will develop a practical phonon laser. The European consortium, called PHENOMEN, will be coordinated by the Catalan Institute of Nanoscience and Nanotechnology (ICN2). Most chips perform functions using an electrical charge (electrons) or by light (photons). In comparison, a phonon “is a quantum of energy or a q... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC as well as the team of GlobalFoundries, IBM and Samsung separately presented papers on 7nm finFET technology. Qualcomm has begun sampling the world’s first 10nm server processor. As the first in the Qualcomm Centriq product family, the ARM-based processor has up to 48-cores and is built ... » read more

Manufacturing Bits: Dec. 6


The National High Magnetic Field Laboratory (MagLab) has broken an unofficial record for the world’s most powerful hybrid magnet. The 33-ton system, called the series connected hybrid (SCH) magnet, has reached its full field strength of 36 tesla. The SCH is more than 40% stronger than the previous world-record hybrid magnet. Tesla, or T, is the measurement of magnetic field strength. A ref... » read more

Optimizing Multiple IoT Layers


As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Manufacturing Bits: Oct. 25


GaN-on-GaN power semis Power semiconductors based on gallium nitride (GaN) are heating up in the market. Typically, suppliers are shipping devices using a GaN-on-silicon process. These devices are available with blocking voltages of up to 650 volts. Going beyond 650 volts is problematic, however. GaN-on-silicon processes suffer from lattice mismatches, cost and other issues. At the ... » read more

The Week In Review: Manufacturing


Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

Focus Shifts To Architectures


Chipmakers increasingly are relying on architectural and micro-architectural changes as the best hope for improving power and performance across a spectrum of markets, process nodes and price points. While discussion about the death of [getkc id="74" comment="Moore's Law"] predates the 1-micron process node, there is no question that it is getting harder for even the largest chipmakers to st... » read more

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