Manufacturing Bits: Oct. 25

GaN-on-GaN power semis Power semiconductors based on gallium nitride (GaN) are heating up in the market. Typically, suppliers are shipping devices using a GaN-on-silicon process. These devices are available with blocking voltages of up to 650 volts. Going beyond 650 volts is problematic, however. GaN-on-silicon processes suffer from lattice mismatches, cost and other issues. At the ... » read more

The Week In Review: Manufacturing

Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

Focus Shifts To Architectures

Chipmakers increasingly are relying on architectural and micro-architectural changes as the best hope for improving power and performance across a spectrum of markets, process nodes and price points. While discussion about the death of [getkc id="74" comment="Moore's Law"] predates the 1-micron process node, there is no question that it is getting harder for even the largest chipmakers to st... » read more

The Week In Review: IoT

Deals VMware this week announced Internet of Things strategic alliances with Bayshore Networks, Dell, Deloitte Digital, Intwine Connect, PTC, and V5 Systems. IDC estimates IoT spending will reach almost $1.3 trillion by 2019. "IoT is said to be the largest addressable market since the advent of the Internet, and the true potential of IoT has yet to be realized in the enterprise. As a company t... » read more

New Starting Point

Debate has been raging for years about whether software or hardware should be the starting point for improving power and performance, or whether it should elevated another notch by fusing hardware and software into a system-level approach. Now, groups like Leti, IEEE, SEMI, and a number of researchers in leading universities around the globe are beginning to talk about moving the starting point... » read more

Advanced Packaging Options, Issues

Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

Photonics Moves Closer To Chip

Silicon photonics is resurfacing after more than a decade in the shadows, driven by demands to move larger quantities of data faster, using extremely low power and with minimal heat. Until recently, much of the attention in photonics focused on moving data between servers and storage. Now there is growing interest at the PCB level and in heterogeneous multi-chip packages. Government, academi... » read more

How To Build Systems In Package

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Open Standards For Verification?

The increasing use of verification data for analyzing and testing complex designs is raising the stakes for more standardized or interoperable database formats. While interoperability between databases in chip design is not a new idea, it has a renewed sense of urgency. It takes more time and money to verify increasingly complex chips, and more of that data needs to be used earlier in the fl... » read more

Going Open Source

Open Source often is thought of as an alternative to commercial software licensed using fairly typical business models. For example, variants of open source Linux supplied by companies such as Red Hat charge a subscription for support and maintenance. Maybe there is an opportunity to leverage Open Source alongside commercial EDA software to provide use model advantages and open development f... » read more

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