Deeper Inside Intel


Mark Bohr, senior fellow and director of process architecture and integration at Intel, and Zane Ball, vice president in the Technology and Manufacturing Group at Intel and co-general manager of Intel Custom Foundry, sat down with Semiconductor Engineering to discuss the future directions of transistors, process technology, the foundry business and packaging. What follows are excerpts of those ... » read more

Challenges Mount For Patterning And Masks


Semiconductor Engineering sat down to discuss [getkc id="80" comment="lithography"] and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief execu... » read more

Bit Mapping


The rule of thumb for semiconductor manufacturing is that big breakthroughs tend to last a decade, or about five process nodes. While the transistor already has spanned more than five decades and the IC more than four decades, the technology used to create them typically only lasts about one. 193nm lithography has been around more than a decade. Bets were being made publicly back at 45nm—o... » read more

Aloha Lithography!


An excuse to travel to Hawaii?  You don’t have to ask me twice.  Especially if it is the Big Island, my favorite of the Hawaiian isles.  My excuse this time?  The 3-beams conference, also called triple-beams, EIPBN, or occasionally (rarely) the International Conference on Electron, Ion and Photon Beam Technology & Nanofabrication. The conference was held last week (May 29 – June ... » read more