Building Faster Chips

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

Is The 2.5D Supply Chain Ready?

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more