Blog Review: May 10


Mentor's Scott Salzwedel checks out what's next for the New Horizons space probe when it comes out of hibernation later this year. Cadence's Paul McLellan provides a look at how NASA took on changing the organization's culture towards safety after the space shuttle Columbia accident. Synopsys' Robert Vamosi points to recent malware that may be affecting between 100K and 200K Windows boxes... » read more

Advanced Packaging Goes Mainstream


The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

Intel Inside The Package


Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down with Semiconductor Engineering to discuss the growing importance of multi-chip integration in a package, the growing emphasis on heterogeneity, and what to expect at 7nm and 5nm. What follows are excerpts of that interview. SE: There’s a move toward more heterogeneity in designs. Intel clearly ... » read more

The Week In Review: Manufacturing


Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

Verification And The IoT


Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Blog Review: May 3


Cadence's Paul McLellan shares highlights from a recent IRDS panel, including changing the assumptions about computing and looking for the next "killer app." Synopsys' Meenakshy Ramachandran introduces the array of improvements in HDMI 2.1, from higher bandwidth to Dynamic HDR. Mentor's Minghui Fan checks out advancements in optical proximity correction and resolution enhancement technolo... » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

Blog Review: April 26


Cadence's Paul McLellan provides an introduction to single-event effects and the challenges created when high-energy neutrons bombard chips. Synopsys' Robert Vamosi looks at the strange turf war between two worms battling for control of IoT security cameras. Mentor's Ayan Pahwa contends that it's the duty of IoT device developers to take security as paramount factor and provide good secur... » read more

22nm Process War Begins


Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Cloud Computing Chips Changing


An explosion in cloud services is making chip design for the server market more challenging, more diverse, and much more competitive. Unlike datacenter number crunching of the past, the cloud addresses a broad range of applications and data types. So while a server chip architecture may work well for one application, it may not be the optimal choice for another. And the more those tasks beco... » read more

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