Fab Spending Hits New High


The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe has also increased significantly. In 2017, over US$49 billion will be spent on equipment alone, a historic record for the semiconductor industry. Spending on new fab cons... » read more

The Week In Review: Manufacturing


Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

The Week In Review: IoT


Analysis The Internet of Trains? That’s how Siemens sees its work in railroads, utilizing Big Data analytics and Internet of Things technology. “Sensors on an Internet of Trains system monitor everything from engine temperature, to the open or closed state of doors, to vibrations on the rails, and even image data from outside of the trains using cameras,” Bernard Marr writes in this anal... » read more

Carriers Push Datacenter-Style Virtualization


The world’s largest telco carriers are leading a broad movement to bring data center-style virtualization to the core of their telecommunications networks. In an industry known for being extremely conservative when it comes to change, this one appears to be significant. The move has set off a scramble among a number of companies for unified control and forwarding plane designs, starting fr... » read more

Verification And The IoT


Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Blog Review: May 31


Mentor's Michael White predicts that 10nm will come on the scene in a big way this year with a leap to an estimated 9% foundry market share. At the recent RISC-V Workshop, Cadence's Paul McLellan considers whether fully open-source silicon is really viable. Synopsys' Robert Vamosi investigates the security risks posed by the proliferation of connected aftermarket automotive products and a... » read more

RISC-V Pros And Cons


Simpler, faster, lower-power hardware with a free, open, simple instruction set architecture? While it sounds too good to be true, efforts are underway to do just that with RISC-V, the instruction-set architecture (ISA) developed by UC Berkeley engineers and now administered by a foundation. It has been known for some time that with [getkc id="74" comment="Moore's Law"] not offering the same... » read more

The Week In Review: IoT


Analysis Whither Intel’s Internet of Things efforts? “While Intel's IoT business certainly won't solve its ongoing troubles in the PC and data center markets anytime soon, staying invested in that market will ensure that the chipmaker doesn't miss another major technological shift, as it did with mobile devices about a decade ago,” Leo Sun writes in this analysis. Products Cisco Sys... » read more

Foundry Wars, Take Two


Samsung, GlobalFoundries, TSMC and Intel all have declared their intention to fill in nearly every node possible with multiple processes, different packaging options, and new materials. In fact, the only number that hasn't been taken so far is 9nm. It's not that one foundry's 10nm is the same as another's. Each company defines its nodes differently, and these days comparing nodes is almost m... » read more

Samsung Unveils Scaling, Packaging Roadmaps


Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

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