tag: interconnects

Interconnects Essential To Heterogeneous Integration
By Karen Heyman - 28 Mar, 2024 - Comments: 0

Designing and manufacturing interconnects is becoming more complex, and more critical to device reliability, as the chip industry shifts from monolithic planar dies to collections of chips and chiplets in a package. What was once as simple as laying down a copper trace has evolved into tens of thousands of microbumps, hybrid bonds, through-silicon vias (TSVs), and even junctions for optical ... » read more

An All-Optical General-Purpose CPU And Optical Computer Architecture (Akhetonics)
By Technical Paper Link - 11 Mar, 2024 - Comments: 0

A technical paper titled “An All-Optical General-Purpose CPU and Optical Computer Architecture” was published by researchers at Akhetonics. Abstract: "Energy efficiency of electronic digital processors is primarily limited by the energy consumption of electronic communication and interconnects. The industry is almost unanimously pushing towards replacing both long-haul, as well as local c... » read more

Shedding More Light On Photonics For Multi-Die Systems
By Kenneth Larsen - 21 Dec, 2023 - Comments: 0

By Kenneth Larsen and Twan Korthorst Photonics harness the speed of light for fast, low-power, high-capacity data transfer. A tremendous amount of data needs to be moved swiftly across different components in a multi-die system. Considering this, exploiting the advantages of light is one way to mitigate heat dissipation and energy consumption concerns while delivering fast data transmission.... » read more

Leveraging IBIS-AMI Models To Optimize PCIe 6.0 Designs
By Synopsys - 12 Dec, 2023 - Comments: 0

The exploding demand for more data driven by advancements such as artificial intelligence and machine learning has created an increase in bandwidth (BW) for interconnects for different systems and hardware components such as graphic cards, network cards, storge devices, CPUs, memories, and many more. PCIe is the leading high-speed serial communication protocol for connecting such hardware compo... » read more

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Ensuring The Health And Reliability Of Multi-Die Systems
By Yervant Zorian - 26 Oct, 2023 - Comments: 0

From generative AI tools that rapidly produce chatbot responses to high-performance computing (HPC) applications enabling financial forecasting and weather modeling, it’s clear we’re in a whole new realm of processing power demand. Given these compute-intensive workloads, monolithic SoCs are no longer capable to meet today’s processing needs. Engineering ingenuity, however, has answered t... » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

Building Better Bridges In Advanced Packaging
By Laura Peters - 21 Sep, 2023 - Comments: 1

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what works best for different processes and technologies. At its core, advanced packaging depends on reliable interconnects, well-def... » read more

Mitigating Electromigration In Chip Design
By Akanksha Soni - 20 Jul, 2023 - Comments: 0

From smartphones to laptops, we use a variety of devices every day that rely on integrated circuits (ICs), or chips, to function. These chips are made up of thousands of transistors and interconnects, which transmit electrical signals from one part of the chip to another. But as demand for speed and complexity forces more energy through ever-smaller devices, this concentrated current flow can t... » read more

The Future Of Chiplet Reliability
By Nir Sever - 11 Jul, 2023 - Comments: 0

Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with dies in different process nodes while improving yield, which decreases exponentially with size. However, 2.5D/3D designs introduce a fair share of new challenges, one of the most significant be... » read more

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