By Michael P.C. Watts
At Photonics West, Dow Corning and IBM disclosed a photo-patternable optical interconnect materials set that can support 25 cm interconnect lengths, can be part of a flexible PCB, and survive the industry standard “Telcordia” environmental stress test.
The idea of optical interconnect has been circulating as soon as it was realized that chip to chip communication...
» read more
