Design Complexity Drives New Automation


As design complexity grows, so does the need for every piece in the design flow—hardware, software, IP, as well as the ecosystem — to be tied together more closely. At one level, design flow capacity is simply getting bigger to accommodate massive [getkc id="185" kc_name="finFET"]-class designs. But beyond sheer size, there are new interactions in the design flow that place much more emp... » read more

The Hidden Costs Of Security


There is no argument these days among chipmakers that security needs to be implemented at every level. So why isn't it happening? The answer is more complex than companies pinching pennies, although that is certainly a factor for some chips. The reality, though, is security carries a price for every facet of semiconductor design—power, performance and area. And the impact reaches much furt... » read more

The Week In Review: Manufacturing


Chipmakers China’s IC industry is embarking on a recruitment drive to prepare for the operation of new fabs in 2018, according to TrendForce. “TrendForce’s latest analysis on China’s semiconductor sector reveals that the country’s domestic IC manufacturers are affecting the movement of industry talent worldwide as they continue to aggressively headhunt for senior managers and enginee... » read more

Focus Shifts To Architectures


Chipmakers increasingly are relying on architectural and micro-architectural changes as the best hope for improving power and performance across a spectrum of markets, process nodes and price points. While discussion about the death of [getkc id="74" comment="Moore's Law"] predates the 1-micron process node, there is no question that it is getting harder for even the largest chipmakers to st... » read more

How To Build Systems In Package


The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more