tag: Kulicke & Soffa

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 15 Apr, 2022 - Comments: 0

Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Technology Advances, Shortages Seen For Wire Bonders
By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Feb, 2022 - Comments: 2

Government policy The Government of Quebec and IBM have announced a new partnership to establish Quebec as a technology hub in the development of quantum computing, artificial intelligence, semiconductors and high-performance computing. The two entities have formed the Quebec-IBM Discovery Accelerator. The new technology hub aims to focus on developing new projects, collaborations, and skills-... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Smart Backend Assembly Factory For Industry 4.0
By Bee Bee Ng - 22 Oct, 2020 - Comments: 0

I recently spoke with Chan Pin CHONG, Executive Vice President and General Manager of Products and Solutions at Kulicke & Soffa, about how smart manufacturing is driving new production efficiencies in the semiconductor industry. During our conversation, he also provided practical steps for factory operators to follow in evaluating their smart manufacturing needs in order to ensure successfu... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

What’s Next In Advanced Packaging
By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

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