Blog Review: Mar. 21

Mentor's Colin Walls shares five more quick tips for embedded software programming, including t real time systems, programming philosophy, and C++ operator overloading. Cadence's Paul McLellan digs into recently released semiconductor company ratings, the role of memory in shaking up the list, and China's plans for more 3D NAND and DRAM fabs. Synopsys' Taylor Armerding examines the latest... » read more

EUV’s New Problem Areas

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

The Week In Review: Manufacturing

Chipmakers and OEMs Last month, Arizona approved Google’s Waymo unit to begin testing a commercial self-driving vehicle program. And recently, Waymo released a video showing its first autonomous ride-hailing service. “This development inches us closer than ever to a ‘first-man-on-the-moon’ landmark for Level 5 autonomous transport,” said Derek Viita, an analyst from Strategy Analytic... » read more

How Atomic Layer Deposition Works

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition (ALD) is a reality. In fact, it’s being used in an ever-increasing number of applications as an extremely precise and controllable process for creating thin films. Together with its etch counterpart – atomic layer etching (ALE) – ALD is enabling the us... » read more

DSA Re-Enters Litho Picture

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

The Next 5 Years Of Chip Technology

Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational litho products at ASML; and Shay... » read more

The Week In Review: Manufacturing

Chipmakers and OEMs After more than four years as chief executive of GlobalFoundries, Sanjay Jha will hand over the company’s top position to Thomas Caulfield, senior vice president and general manager at the foundry vendor. Caulfield, who joined GlobalFoundries in 2014, will become CEO. He has been running the company's fab in New York. "Jha intends to work closely with the company’s shar... » read more

Toward High-End Fan-Outs

Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

The Week In Review: Manufacturing

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

Blog Review: Feb. 28

Mentor's Matthew Ballance explains just what the portable stimulus standard makes portable. Cadence's Dave Pursley considers why high-level synthesis is a good fit for cutting-edge machine learning designs. Synopsys' Melissa Kirschner notes that the growing number of IoT devices means new opportunities for one-time programmable NVM. Applied's Mike Rosa considers the pros and cons of 5G... » read more

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