Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: March 26

By Linda Christensen - 26 Mar, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=209 /] Find last week's technical paper additions here. » read more

An Open Hardware Approach in Quantum Technology

By Technical Paper Link - 19 Mar, 2024 - Comments: 0

A technical paper titled "Open Hardware Solutions in Quantum Technology" was published by researchers at Unitary Fund, Qruise GmbH, Technical University of Valencia, Lawrence Berkeley National Laboratory, Fermi National Accelerator Laboratory, Sandia National Laboratories, and others. Abstract "Quantum technologies such as communications, computing, and sensing offer vast opportunities for ... » read more

Research Bits: Mar. 11

By Jesse Allen - 11 Mar, 2024 - Comments: 0

Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

Chip Industry’s Technical Paper Roundup: Dec 11

By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons

By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

Chip Industry’s Technical Paper Roundup: October 17

By Liz Allan - 17 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Research Bits: October 17

By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

An Overview Of Current Projects In The Open Quantum Hardware Ecosystem With Recommendations

By Technical Paper Link - 12 Oct, 2023 - Comments: 0

A technical paper titled “Open Hardware in Quantum Technology” was published by researchers at Unitary Fund, Qruise, Technical University of Valencia, M-Labs Limited, Lawrence Berkeley National Laboratory, Fermi National Accelerator Laboratory, Sandia National Laboratories, IQM Quantum Computers, PASQAL, Quantonation, Michigan State University, Università di Camerino, Microsoft Quantum, an... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

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