Auto Industry Driving Faster


Automotive electronics used to be a lumbering, trailing-edge business. Not anymore. Today, powerful semiconductor technologies are driving the development of automotive features that once might have been seen as science fiction, such as advanced driver-assistance systems (ADAS) which are paving the way to self-driving cars. Overall, the market for semiconductors in automotive applications is... » read more

Processing Moves To The Edge


Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

LiDAR Goes Back To The Future


LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Verification Of Functional Safety


The automotive industry is grappling with a tradeoff between cost and safety. Safety is well understood in industries that are cost-insensitive, such as aerospace and medical, and the consumer industry has a long track record of driving down costs while increasing functionality. But can these two industries be brought together in a safe and effective manner to enable automobiles to achieve the ... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

Driving By Ethernet


The race to add more sophisticated and safety-critical electronics into cars is forcing carmakers to revisit the communications systems within increasingly electrified and connected vehicles. Until very recently, communication between components within a vehicle was simplistic, and communication between vehicles was non-existent. All of that is changing quickly. Rapid and secure communicatio... » read more

The Road To Autonomy


Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

Automotive Startup Activity Swelling


According to AngelList, there are at least 6,600 automotive startups, with a $4.6 million average valuation. 475 of those are electric vehicle startups with a $5 million average valuation. Indeed, the electrification of vehicles and move towards autonomous driving is having a huge impact, the likes of which the automotive industry has never seen. This is causing the car manufacturers and Tie... » read more

Fan-Outs vs. TSVs


Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

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