tag: LVS

Successful 3D-IC Design, Verification, And Analysis Requires An Integrated Approach
By Siemens EDA - 30 Nov, 2023 - Comments: 0

3D-IC designs enable improvements in performance, power, footprint, and costs that cannot be attained in system-on-chip (SoC) and IC design. However, the leap from traditional SoC/IC design to 3D-IC designs brings not only new opportunities, but also new challenges. Siemens EDA provides multiple 3D-IC design analysis and verification functionalities that address the diverse needs of 3DIC des... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

Fast, Focused Early-Stage Circuit Verification Can Get You To Signoff Faster
By Kesmat Shahin - 23 Feb, 2023 - Comments: 0

Designers everywhere know that with the increasing complexity of integrated circuits (ICs), meeting tapeout schedules has become increasingly difficult. While there are often many reasons for missing tapeouts, one critical component is the significant amount of time needed to run the signoff layout verification cycle, which contributes to overall signoff process duration. Much of this schedule ... » read more

Achieve Dramatic Productivity And Turnaround Time Improvements In Early Design Electrical Rule Checking
By Siemens EDA - 22 Feb, 2023 - Comments: 0

Early-stage layout vs. schematic (LVS) and circuit verification typically return large numbers of connectivity errors, which can be a critical bottleneck for both LVS and physical verification flows that require correct connectivity for valid results. The Calibre nmLVS Recon tool targets essential and relevant early-stage circuit verification pain points, such as electrical rule checking (ERC) ... » read more

Faster And Smarter LVS For The SoC Era
By Synopsys - 26 Oct, 2022 - Comments: 0

Development of a modern system-on-chip (SoC) device is a long and incredibly complex process. Design teams rely on a huge range of tools, technologies, and methodologies to get the job done. Given the ongoing advances in silicon technology and design architecture, the tools are in a constant state of evolution. Logic-versus-schematic (LVS) checking is one of those tools. This is one of the earl... » read more

Meeting Today’s Challenges For LVS
By Manoz Palaparthi - 13 Oct, 2022 - Comments: 0

At least one thing is for certain in semiconductor development: bigger and more complex designs put lots of pressure on electronic design automation (EDA) tools and methodologies. Yesterday’s chip is today’s IP block, and entire racks of electronics are being packed into system-on-chip (SoC) devices. EDA tools must evolve constantly in order to keep pace with size and complexity while meeti... » read more

Faster & Smarter LVS For The SoC Era
By Synopsys - 21 Sep, 2022 - Comments: 0

Development of a modern system-on-chip (SoC) device is a long and incredibly complex process. Design teams rely on a huge range of tools, technologies, and methodologies to get the job done. Given the ongoing advances in silicon technology and design architecture, the tools are in a constant state of evolution. Logic-versus-schematic (LVS) checking is one of those tools. This is one of the earl... » read more

Improving Design Collaboration In The Age Of Remote Work
By Amit Varde - 13 Sep, 2022 - Comments: 0

Teams of analog and mixed signal (AMS) design and layout engineers spend countless hours extracting every ounce of performance out of their design. They continually make incremental changes daily to the design until the very end, as close to tape out as possible. Each change made to the design requires corresponding changes to the circuit layout. As technology advances, accounting for the paras... » read more

Challenges With Stacking Memory On Logic
By Ed Sperling - 22 Dec, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Optimize Physical Verification Cost Of Ownership
By Manoz Palaparthi - 29 Jul, 2021 - Comments: 0

As semiconductor designs continue to grow in size and complexity, they put increasing pressure on every stage of the design process. Physical verification, often on the critical path to tape-out, is especially affected. Design rule checking (DRC), layout versus schematic (LVS), and other physical verification runs take longer as chip size increases. In addition, finer geometries introduce new c... » read more

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