Cheaper Packaging Options Ahead


Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

How Ethernet Will Change Automotive Networks


The in-vehicle networks currently used in automobiles are based on a combination of several different data networking protocols, some of which have been in place for decades. There is the controller area network (CAN), which takes care of the powertrain and related functions; the local interconnect network (LIN), which is predominantly used for passenger/driver comfort purposes that are not tim... » read more

The Week In Review: Design


Security Addressing the Meltdown and Spectre speculative execution vulnerabilities has not gone smoothly. Intel's firmware update caused unexpected behavior and a higher than expected number of reboots for its Haswell and Broadwell chips, leading the company to recommend users stop patching until an updated version of the patch is available. Microsoft's attempts to fix the issue left some W... » read more

Blog Review: Jan. 17


Mentor's Puneet Sinha identifies the key challenges, along with cost reduction and optimization opportunities, that come with using electric powertrains in autonomous vehicles. Synopsys' Robert Vamosi examines the impact of limited cellular networks on autonomous cars, and new communications protocols that could address coverage gaps. Cadence's Paul McLellan listens in as Lucian Shifren o... » read more

Getting Serious About Chiplets


Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Reshaping Automotive Design


The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

HPC Case Study: CFD Applications On ARM


In this paper, we examine the readiness and potential of ARM-based platforms for High Performance Computing, and have benchmarked two different computational fluid dynamics (CFD) applications. CFD represents one of the most widely used HPC applications in aerospace, automotive and other engineering areas such as turbine-design. For server hardware, we leverage the ThunderX platform from Cavium,... » read more

Pushing DRAM’s Limits


If humans ever do create a genuinely self-aware artificial intelligence, it may well exhibit the frustration of waiting for data arrive. The access bandwidth of DRAM-based computer memory has improved by a factor of 20x over the past two decades. Capacity increased 128x during the same period. But latency improved only 1.3x, according to Kevin Chang, a researcher at Carnegie Mellon Universit... » read more

Tech Talk: 802.11ax Multi-User


Daniel Webb, staff marketing manager at Marvell, talks about the new wireless standard, what's needed to make it work, and why it's so critical in the home and office. https://youtu.be/xIG7J928XFs » read more

Advanced Packaging Is Suddenly Very Cool


The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

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