The Week In Review: Manufacturing


Market research For some time, DRAM shortages have plagued the market. Today, the situation remains the same. DRAMs are seeing strong demand. But yet, vendors are not adding any capacity. “Strained DRAM supply was even more evident during the third quarter as limited production capacity and limited technological progress for the memory industry encountered robust demand from data centers in ... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week In Review: Design


M&A Silvaco finalized its acquisition of SoC Solutions. The Georgia-based company was founded in 2000. Its team and portfolio of pre-configured IP subsystems and IoT/M2M IP will join Silvaco's IP group. Terms were not disclosed. Siemens PLM will acquire TASS International, a provider of simulation software, engineering and test services aimed primarily at the automotive industry. Based ... » read more

The Week In Review: Design


IP Synopsys unveiled High Bandwidth Memory 2 (HBM2) IP. The package includes PHY, controller and verification IP and supports data rates up to 2400Mb/s, 20% faster than the JEDEC standard specification. The controller supports pseudo-channel operation in either lock step or memory interleaved mode, and the PHY offers four trained power management states and fast frequency switching. Cadence... » read more

The Week In Review: IoT


Finance Trend Micro, the cybersecurity firm, announced a corporate venture fund of $100 million to invest in emerging technology markets, including the Internet of Things. Gartner estimates 26 billion devices will be connected to the Internet by 2020. Products Cisco Jasper introduced the Control Center 7.0 IoT connectivity management platform, with advanced capabilities, premium services, ... » read more

The Week In Review: Manufacturing


Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

The Week In Review: Manufacturing


Market research Intel held a slim 4% lead over Samsung for the number one position in terms of chip sales in the first quarter, according to IC Insights. But as reported, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in the second quarter, according to the firm. Meanwhile, in the ranking, SK Hynix and Micron made the biggest moves. And there was one new e... » read more

Can Formal Replace Simulation?


A year ago, [getentity id="22147" comment="Oski Technology"] achieved something that had never happened before. It brought together 15 of the top minds in [getkc id="33" kc_name="formal verification"] deployment and sat them down in a room to discuss the problems and issues they face and the ways in which they are attempting to solve those problems. Semiconductor Engineering was there to record... » read more

The Week In Review: Design


Name Changes Arteris changed its name to ArterisIP. The company said the name change better reflects what the company does, which is provide IP for SoC communication on-die and between die. Mentor Graphics also modified its name, following last week's announcement that the acquisition by Siemens has been completed. The company is now officially called Mentor, A Siemens Business. It also ... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

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