Integration Or Segregation

In the Electronics Butterfly Effect story, the observation was made that the electronics industry has gone non-linear, no longer supported by incremental density and cost-reducing improvements that Moore’s Law promised with each new node. Those incremental changes, over several decades, have meant that design and architecture have followed a predictable path with very few new ideas coming in ... » read more

Momentum Builds For Monolithic 3D ICs

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more