Performance Increasingly Tied To I/O


Speeding up input and output is becoming a cornerstone for improving performance and lowering power in SoCs and ASICs, particularly as scaling processors and adding more cores produce diminishing returns. While processors of all types continue to improve, the rate of improvement is slowing at each new node. Obtaining the expected 30% to 50% boost in performance and lower power no longer can ... » read more

2017: Manufacturing And Markets


While the industry is busy chatting about the end of Moore's Law and a maturing of the semiconductor industry, the top minds of many companies are having none of it. A slowdown in one area is just an opportunity, in another and that is reflected in the predictions for this year. As in previous years, Semiconductor Engineering will look back on these predictions at the end of the year to see ... » read more

Reflecting Back On 2016


Anyone can make a prediction, and sometimes the more outlandish they are the more they get noticed. But at the end of the year some people hit the mark while others may have been way off. Many people simply make projections based on the current trajectory of trends, while others look for the potential discontinuities that may lie ahead. Semiconductor Engineering examines the projections made... » read more

Uncertainty Grows For 5nm, 3nm


As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

Morphing Moore’s Law


In 1965, Gordon Moore defined a timetable for doubling the number of transistors on a piece of silicon every two years. The law, as he originally defined it, is now hopelessly outdated. Any attempts to apply it to the most advanced chips today are a stretch at best, and complete fiction at worst. No one is on a two-year cadence between process nodes anymore—not even Intel. In fact, no one ... » read more

Tech Talk: FD-SOI vs. FinFET


Jamie Schaeffer, 22FDX program director at GlobalFoundries, talks about the future of FD-SOI, what the tradeoffs are in performance, power and cost compared with finFETs, how many mask layers and patterning steps are required for each, and when 12nm FD-SOI will be introduced. Related Stories To 7nm And Beyond GlobalFoundries’ top technologists open up on next-gen FD-SOI, the economi... » read more

What Comes After Moore’s Law And Dennard Scaling?


For decades, Moore’s Law has been an important semiconductor industry mainstay that has helped fuel a relentless progression in computing performance. However, most industry experts agree that Moore’s Law is waning, with an end on the horizon due to a combination of physical limitations and economic factors. With the loss of Dennard Scaling roughly 10 years ago, the industry is at a critica... » read more

IoT, Architectures, And Security


Mike Muller, CTO of [getentity id="22186" comment="ARM"], sat down with Semiconductor Engineering to talk about security, IoT market changes, and future technology requirements. What follows are excerpts of that conversation. SE: Security is a growing problem. How do we deal with it? Muller: However fast the world is moving, if you look at fundamental hardware and system design, it’s ru... » read more

Multi-Patterning Issues At 7nm, 5nm


Continuing to rely on 193nm immersion lithography with multiple patterning is becoming much more difficult at 7nm and 5nm. With the help of various resolution enhancement techniques, optical lithography using a deep ultraviolet excimer laser has been the workhorse patterning technology in the fab since the early 1980s. It is so closely tied with the continuation of [getkc id="74" comment="Mo... » read more

New Wave Of Consolidation


Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

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