More EUV Mask Gaps


Extreme ultraviolet (EUV) lithography is at a critical juncture. After several delays and glitches, [gettech id="31045" comment="EUV"] is now targeted for 7nm and/or 5nm. But there are still a number of technologies that must come together before EUV is inserted into mass production. And if the pieces don’t fall into place, EUV could slip again. First, the EUV source must generate more ... » read more

Why EUV Is So Difficult


For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding. More recently, though, [gettech id="31045" comment="EUV"] lithography appears to be inching closer to pos... » read more

Deploying Multi-Beam Mask Writers


Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss the company’s deal with Intel, photomasks, multi-beam mask writer technology and other topics. What follows are excerpts of that conversation. SE: This has been a significant year for IMS for two reasons. First, Intel recently announced plans to acquire IMS. Second, at the recent ... » read more

What Happened To DSA?


Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

Where Is Next-Gen Lithography?


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and senior director of technology research at GlobalFoundries; Uday Mitra, vice president and head of strategy and marketing for the Etch Business Unit and Patterning Module at Applied Materials; Naoya Haya... » read more

Pain Points At 7nm


Early work has begun on 7nm. Process technology has progressed to the point where IP and tools are being qualified. There is still a long way to go. But as companies begin engaging with foundries on this process node—[getentity id="22586" comment="TSMC"] is talking publicly about it, but [getentity id="22846" e_name="Intel"], [getentity id="22819" comment="GlobalFoundries"] and [getentity ... » read more

Multi-Beam Market Heats Up


The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market. In one surprising move, [getentity id="22846" e_name="Intel"] is in the process of acquiring IMS Nanofabrication, a [gettech id="31058" t_name="multi-beam e-beam"] equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer t... » read more

7nm Lithography Choices


Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm. Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies ... » read more

Inside Multi-Beam E-Beam Lithography


Semiconductor Engineering sat down with David Lam, chairman of Multibeam, a developer of multi-beam e-beam tools for direct-write lithography applications. Lam is also a venture capitalist. He founded Lam Research in 1980, but left as an employee in 1985. What follows are excerpts of that conversation. SE: How has the equipment business changed over the years and what’s the state of the i... » read more

More Choices, Less Certainty


The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

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