tag: multi-beam e-beam

Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge
By Jan Willis - 19 Dec, 2023 - Comments: 0

The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes using 193i lithography. A panel of semiconductor photomask and lithography experts debated several of the survey results, including this one, to provide more insights behind the results. Aki Fujimura, CEO of D2S, Inc., the managing company sponsor of t... » read more

Big Changes Ahead For Photomask Technology
By Gregory Haley - 19 Oct, 2023 - Comments: 0

The move to curvilinear shapes on photomasks is gaining steam after years of promise as a way of improving yield, lowering defectivity, and reducing wasted space on a die — all of which are essential for both continued scaling and improved reliability in semiconductors. Interest in this approach ran high at this year's SPIE Photomask Technology + EUV Lithography Conference. Put simply, cur... » read more

Multi-Beam Writers Are Driving EUV Mask Development
By Jan Hendrik Peters - 25 Jul, 2023 - Comments: 1

By Jan Hendrik Peters (bmbg consult) and Ines Stolberg (Vistec Electron Beam) The European Mask and Lithography Conference (EMLC) 2023, held in Dresden this past June, was attended by about 180 people and over 60 talks and posters were presented. With several keynote and invited talks over two and a half days, the conference gave an overview of the semiconductor and technology landscape in E... » read more

Multi-Beam Mask Writers Are A Game Changer
By Jan Willis - 22 Dec, 2022 - Comments: 0

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth. A panel of experts debated remaining barriers to curvilinear photomask adoption during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 compan... » read more

E-beam’s Role Grows For Detecting IC Defects
By Karen Heyman - 12 Jul, 2022 - Comments: 1

The perpetual march toward smaller features, coupled with growing demand for better reliability over longer chip lifetimes, has elevated inspection from a relatively obscure but necessary technology into one of the most critical tools in fab and packaging houses. For years, inspection had been framed as a battle between e-beam and optical microscopy. Increasingly, though, other types of insp... » read more

Mask And Metrology Technology Trends
By Bob Smith - 21 Apr, 2022 - Comments: 0

Aselta Nanographics of Grenoble, France, which produces software for wafer and mask patterning based on e-beam technology for IC manufacturing, along with advanced metrology solutions for scanning electron microscopes, recently became an ESD Alliance member. Adding to its impressive credentials, Aselta is a spin-off of CEA-Leti, the electronics and information technologies research institut... » read more

2019-2020 Mask Maker Survey Results
By eBeam Initiative - 21 Oct, 2020 - Comments: 0

The survey results of the 2019-2020 Mask Maker Survey from the eBeam Initiative. • Multi-Beam and EUV Trends Becoming Visible • 558,834 masks reported by 10 different companies than last year • Masks written with Multi-Beam Mask Writers more than doubled • EUV mask yield reported at 91% • MPC usage increasing at leading edge nodes Click here to see the presentation. » read more

eBeam Initiative Surveys Report Upbeat Photomask Market Outlook
By Jan Willis - 05 Oct, 2020 - Comments: 0

Every year, the eBeam Initiative conducts surveys that provide valuable insight into the key trends that are shaping the semiconductor industry. This year, industry luminaries representing 42 companies from across the semiconductor ecosystem participated in the 2020 eBeam Initiative Luminaries survey. 89% of respondents to the survey predict that photomask (mask) revenues in 2020 will stay the ... » read more

Finding Defects With E-Beam Inspection
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Challenges Grow For Finding Chip Defects
By Mark LaPedus - 19 Sep, 2019 - Comments: 5

Several equipment makers are developing or ramping up a new class of wafer inspection systems that address the challenges in finding defects in advanced chips. At each node, the feature sizes of the chips are becoming smaller, while the defects are harder to find. Defects are unwanted deviations in chips, which impact yield and performance. The new inspection systems promise to address the c... » read more

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