10nm FinFET Market Heats Up

The 10nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, Intel announced its 10nm finFET process, with plans to ramp up the technology in 2017. Then, TSMC recently introduced its 10nm process, with plans to move into production by the fourth quarter of 2016. Now, Samsung Electronics said that it has commenced mass... » read more

The Pitfalls Of Auto-Stitching In Double-Patterning

Ever since the first double-pattern (DP) odd-cycle error ring was produced on a layout, designers have longed for a magic solution to solve it. Traditionally, the first approach to fixing an odd-cycle error was to move a polygon or a polygon edge to increase spacing to an adjoining polygon in the cycle. Alternatively, you could remove a polygon altogether, or split it into two pieces. All of th... » read more

Re-Coloring ECO Changes With Calibre Multi-Patterning

Engineering change orders (ECOs) can wreak havoc on multi-patterning (MP) coloring (and time to market) if not dealt with quickly and efficiently. Design teams working on MP designs need a complete ECO enablement solution, before recoloring issues consume resources and destroy schedules. The Calibre Multi-Patterning tool provides smart, automated support for recoloring designs after ECO impleme... » read more

Introduction To Multi-Patterning

Multi-patterning enables accurate lithographic resolution at today's most advanced nodes. Learn about the basics of this technology, and how it impacts your IC design and verification tasks and responsibilities. To read more, click here. » read more

Atomic Layer Etch Heats Up

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

Plotting The Next Semiconductor Road Map

The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more


The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

What Happened To DSA?

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

Assume Nothing: Clearing Up Common Misconceptions About Multi-Patterning

Multi-patterning (MP) makes IC design and manufacture possible at advanced nodes, and Calibre Multi-Patterning technology automates the MP process. However, the complexity of MP and the potential costs of failure require a clear understanding of the process and its limitations. Even though MP has been used for several nodes, there are still some serious disconnects in industry expectations and ... » read more

7nm Fab Challenges

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

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