Hyperscaling The Data Center


Enterprise data centers increasingly will look and behave more like slimmed-down versions of hyperscale data centers as chipmakers and other suppliers adapt systems developed for their biggest customers to in-house IT faciilities. The new chips and infrastructure that will serve as building blocks in these facilities will be more power-efficient, make better use of space and generate less he... » read more

More Volatility Ahead


The entire semiconductor industry had a wild ride on the stock market this week, plunging on Wednesday and recovering on Thursday. This is just a sign of things to come. The cause of this week's volatility can be tied directly to a Morgan Stanley report, which said that NAND prices have peaked and will begin dropping at the beginning of 2018 because supply has caught up with demand. The repo... » read more

What Happened To ReRAM?


Resistive RAM (ReRAM), one of a handful of next-generation memories under development, is finally gaining traction after years of setbacks. Fujitsu and Panasonic are jointly ramping up a second-generation ReRAM device. In addition, Crossbar is sampling a 40nm ReRAM technology, which is being made on a foundry basis by China’s SMIC. And not to be outdone, TSMC and UMC recently put ReRAM on ... » read more

How Virtual Emulation Gives The Storage Market A Leg Up


By Ben Whitehead and Paul Morrison The storage market demands that huge amounts of data and information be stored securely and be accessible anywhere and anytime, driving the adoption of key technologies and use models. According to GSMAintelligence.com, newly created digital data is doubling every two years. This means increasing amounts of storage must be available at the same pace. A... » read more

Using Emulation to Deliver Storage Market Innovations


SSDs have the unique challenges of using NAND flash as a storage medium. As storage technology and use models continue to evolve, so do the verification tools needed to solve today’s challenges. The Veloce emulator is well suited to address these challenges as has been proven by leading storage companies who are using it today in their production environments. To read more, click here. » read more

What Is Spin Torque MRAM?


The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

Enabling Higher System Performance With NVDIMM-N


The shift from the traditional enterprise data center to the cloud is driving an insatiable demand for increased bandwidth and lower latencies. This is fundamentally reshaping traditional memory, storage, network and computing architectures. Although the semiconductor industry has been innovating to meet the needs of these new architectures, it continues to grapple with a waning Moore’s Law t... » read more

NAND Market Hits Speed Bump


Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

Materials For Future Electronics


Examining the research underway in electronics materials provides a keyhole view into what may be possible in future electronics design. Although some of this research will not end up in commercial products, it does provide an indication of the kinds of problems that are being addressed, how they are being approached, and where the research dollars are being spent. Flexible electronics are a... » read more

Wirebond Technology Rolls On


Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

← Older posts